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High Density Solutions at Scale

Build to Density.

Supporting The High Density You Need

New innovations in AI and High-Performance Computing (HPC) technologies are rapidly changing the way data centers meet our customers’ ever-evolving needs. EdgeConneX is continuously exploring new ways to address the high-density requirements that have become foundational to today’s AI and Machine Learning (ML) applications. Our teams implement the latest in data center cooling technologies to offer industry-leading products and solutions to fully accommodate the higher rack power densities that AI/ML workloads require.

EdgeConneX already supports customers with high-density solutions across its global data center platform. As a long-term member of the NVIDIA DGX-Ready Data Center program, EdgeConneX data centers are inherently designed to support solutions that need the power and performance of users of NVIDIA DGX™ systems.

Flexibility Leveraging Both Liquid & Air-Cooling Technologies

EdgeConneX understands the deployment needs of our customers vary depending on the AI and HPC technologies being deployed. We provide the flexibility and scalability needed by offering a wide range of innovative infrastructure cooling solutions to best align with your specific high-density power requirements.

Our traditional air-cooled technologies support deployments up to 20kW per rack, and when paired with row-based air containment solutions, densities increase to 40kW per rack.

For large scale applications, we partner with our customers to leverage the cooling benefits of liquid-based technologies to enable high-density deployments of 300kW+ per rack, ideal for Build-to-Suit deployments.

Extensive Pedigree Delivering Next Generation Solutions

EdgeConneX has a long track record of data center innovation that is first and foremost focused on our customers’ needs and delivering what they want, at the scale they want, and in the markets where they need capacity.  We provide tailored, high-density data center solutions for our customers, from hyperlocal to hyperscale.

Partner with EdgeConneX and our wide range of high-density data center solutions to help to future-proof your evolving AI and HPC deployment needs, for both now and years to come.

Why use EdgeConneX for AI and High Performance Computing platforms?

High-Density Liquid Cooling Technologies

We offer innovative solutions that enable the ability to deploy AI and HPC infrastructure in a dense environment without the fear of overheating, throttling, or damage to your servers.

Computer server inside of server room.

Improved PUE

Our efficient cooling designs for high-density applications help optimize Power Usage Effectiveness (PUE) and ultimately lower Total Cost of Ownership (TCO) for our customers.


The current pace of innovation requires additional space to grow. Our data center solutions are designed to quickly scale up to accommodate your growth needs.

Custom Layout

If your design requires clustered deployments or PODs due to networking distance limitations, we work closely with you to meet those exact design requirements.

Established Global Supply Chain

We leverage industry-leading in-market partnerships to quickly deploy and deliver your HPC solution on time, and on budget.

EdgeOS DCIM Software

Actively view your AI/HPC deployment with our proprietary platform for real-time remote management and monitoring.


Learn More

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